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Camera Development Kit
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Accessories
  
 
 
 
        8.51MP Sony IMX317 Fixed Focus Camera Module
        Model No.  YDS-CMFL143004-IMX317 V1.0
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

The Sony IMX317 color image sensor used in the YDS-CMFL143004-IMX317 V1.0 wide-angle small lens module is a high-performance CMOS 1/2.5” image sensor that can provide 8-megapixel (3840x2160) image signals at up to 60FPS. The pixel size is 1.62um x 1.62um. When connected to the master board using a coaxial cable, it can support shooting 8MP high-definition images and up to 4K@60FPS (differential) and 4K@30FPS video recording. The board frame size is 14.5x18.1mm, and the size from the top of the module lens to the PCB board is 19.5mm.

 

This camera module is not sold separately. The camera module is solely compatible our company’s Ai Master board as they must be sold in bundle, optionally with WiFi expansion board or Network Ethernet board. 

 

 Specifications  
 Model No. YDS-CMFL143004-IMX317 V1.0
 Image Sensor IMX317
 Image Sensor Type CMOS
 Effective Pixels 8.51 Megapixels
 Sensor Size 1/2.5"
 Pixel Size 1.62 um x 1.62 um
 Video Frame Rate 4K@24/25/30/FPS, 4K@48/50/60FPS (Differential)
2.7K@24/25/30/48/50/60FPS
1080P@24/25/30/48/50/60/120FPS
720P@24/25/30/48/50/60/120/240FPS
 Video Format H.264
 Video Slow Motion OFF, 4K2X, 1080P4X, 720P8X
 Photo Format JPG
 Photo Resolution
 (with Master Board)
20MP (5200x3900) (Differential)
13MP (4160x3120) (Differential)
12MP (4040x3040) (Differential)
10MP (3648x2736) (Differential)
8MP (3840x2160)
5MP (2592x1944)
3MP (2048x1536)
2MP (1920x1080)
 Operating Temperature -10°C to +60°C
 Storage Temperature -20°C to +80°C
 Humidity 20% to 80%
 PCB Dimensions 14.5 x 18.1 mm
 Module Size 14.5 x 18.1 x 19.5 mm
 
 
 
 
 
  
 
  
  
  
 
 
 
 
 
 
 













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